ATE Vision 2020 2010 - Call for Participation

Workshop Begins July 15, 2010!

CALL FOR PARTICIPATION

Scope -- Workshop Registration -- Workshop Highlights -- More Information -- Committees

Scope

As in years past, this workshop will examine where the ATE industry is heading in the near and long-term. Moore's law continues to move forward with denser, large, faster, and highly heterogeneous devices coming our way. Further complications to this situation are the challenges associated with multiple cores on a die and the 3D trends enabled by die-stacking and thru-silicon-vias.

These issues, when added to ever increasing Test complexity, Cost-of-Test and Time-to-Market pressures pose a significant challenge to the ATE industry. To meet these challenges the industry (ATE developers and End-Users together) need to innovate in areas such as: shared interconnect technology, streamlined test program generation methods, better integrated Design-for-Testability tools.

The goal of this workshop is to create an informal forum to discuss those innovations relevant to ATE developers and users. We are looking for solutions and ideas for solutions to the issues we will run into in the 2012/2013 timeframe. What do we need to do differently? What will an ATE need to look like in 2015 and 2020? Are our present technologies adequate for the future and if not what should we be doing to close the gap?

Workshop Registration

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Workshop Registration

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Workshop Highlights

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Keynote address: Ron Leckie, CEO Infrastructure Advisors, will present "ATE Countdown," a review of where the ATE industry has been and where it is heading.

A customer panel session focused on features and capabilities needed in the ATE of the future. This panel is moderated by G. Dan Hutcheson, CEO, VLSI Research.

Panelists: Pete Hodakievic, AMD, Adam Wright, Altera, Roger Barth, Numonyx, Muru Yogathasan, StatsChipPac, Andy Evans, Broadcom

A vendor panel including Chief Technical Officers from major ATE companies. This panel is moderated by Rick Nelson, editor in chief of Test & Measurement World and EDN magazines

Panelists: Gary Fleeman, Advantest, Erik Volkerink, Verigy, Jack O'Brien, Teradyne, Steve Wigley, LTX-Credence, Ben Eldridge, FormFactor

Nine technical presentations, covering 3D test, the functional versus structural test dilemma, high speed I/O test, known good die test among others:

Closing the Structural/Functional Test Gap, Matthias Kamm, Cisco

Expanding test coverage at sort to reduce overall product cost, Dale Anderson, SEMICON & FormFactor

KGD Test and Challenges and solutions for TSV based devices, Marc Loranger, FormFactor

3D Test Challenges and Probing Concepts, Stojan Kanev, Cascade Microtech

Adaptive Test Today and + 20, Robert Daasch, Portland State University

Beyond pass/fail test: The EDA perspective on the role of ATE, Geir Eide, Mentor Graphics

Towards a Universal Digital Pin Architecture: From DC to 10GHz+, Mohamed Hafed, DFT Microsystems

Multi-system Architecture: A New Twist in Cost-of-Test Management, Len Van Eck, LTX-Credence

Welcome (Back) To Functional Test, Ken Lanier, Teradyne

More Information

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General information
Erik Volkerink+1-408-864-7661
erik.volkerink@verigy.com

Committees

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General Chair
E. Volkerink, Verigy

Vice General Chair
S. Davidson, Oracle

Program Chair
D. Armstrong, Advantest

Program Vice Chair
B. Brown, LTX-Credence

Panel Chair
A. Khoche, Consultant

Finance Chair and IEEE Liaison
R. Chandramouli, ARM

Sponsoring Chair
Y. Ma, Advantest

Marketing Chair
A. Gold, Advantest

Registration Chair and SEMICON Liaison
R. Kapur, Synopsys

Marketing Vice Chair
F.-F. Ferhani, Broadcom

Local Arrangements Chair
D. Acharyya, Verigy

Program Committee
R. Barth, Numonyx
P. Burlison, Inovys
K.-Y. Cho, NVIDIA
C. J. Clark, Intellitech
A. Evans, Broadcom
W. Fister, Micron
G. Fleeman, Advantest
B. Gage, Teradyne
M. Hafed, DFT Microsystems
R. Kapur, Synopsys
D. Keezer, GeorgiaTech
R. Lesnikoski, Oracle
Y. Ma, Advantest
J. Moreira, Verigy
P. Muhmenthaler, MUHMY Systems
J. Plusquellic, University of New Mexico
B. Price, NXP
M. Roos, Roos Instruments
J. Rivoir, Verigy
N. Touba, University of Texas
C.W. Wu, Tsing Hua University

For more information, visit us on the web at: http://atevision.tttc-events.org

The 3rd IEEE International Workshop on Automated Test Equipment: ATE Vision 2020 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).